Can the CHIPS Act Save American Dominance in Chip Manufacturing? Should We Care? 

Subramanian S. Iyer, Distinguished Chancellor’s Professor & Charles P. Reames Endowed Chair at UCLA Samueli School of Engineering will provide an update on theses and other topics this Thursday, July 27^th at the BP Silicon Beach Chapter Meeting.   

Subramanian (Subu) S. Iyer (Life Fellow, IEEE) received his B.Tech. degree in electrical engineering from IIT Bombay, Mumbai, India, in 1977, and his Ph.D. degree in electrical engineering from UCLA in 1981. 

He was a Fellow of IBM, and is currently a Distinguished Professor and holds the Charles P. Reames Endowed Chair at the Electrical Engineering Department and a joint appointment at the Materials Science and Engineering Department, UCLA, where he also is the Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS).

 His key technical contributions are numerous and beyond my comprehension but one sounded really cool: he developed a technology used to make the first generation of truly low-power portable devices and the first commercial interposer and 3-D integrated products. He was also among the first to commercialize bonded silicon on insulator (SOI) for CMOS applications through a startup called SiBond LLC. 

More recently, he has been exploring new packaging paradigms and device innovations that may enable wafer-scale architectures, in-memory analog compute, and medical engineering applications at UCLA.

 He has authored over 300 articles and holds over 75 patents. Dr. Iyer received several outstanding technical achievements and corporate awards at IBM. And he is omnipresent in his field through his many awards and posts in organizations.

Cost: $15 for in-person 

RSVP HERE